Deutsche Effecten- und Wechsel-Beteiligungsges. AG

EANS-News: Security for contactless government ID with KSW Microtec Thinlams®

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New Products

Dresden, Germany, March 29, 2010 (euro adhoc) - As governments, financial institutions and other high-security conscious institutions require additional security features on their contactless ID documents and cards, KSW Microtec, one of the world´s leading supplier of RFID components and inlays for secure cards and other form factors, reports an increase in demand for its proven prelaminate Thinlam®.

Issuers of highly secure cards and documents of all types, increasingly demand the addition of new security features. In order to achieve this, multiple layers need to be added and large memory security microcontrollers need to be integrated, while maintaining ISO standards for maximum card thickness. KSW´s polycarbonate inlay Thinlam® is already widely used for this purpose, due to its producible thinness down to 200µm and proven ability to support the manufacturers of contactless documents with multiple layers and security features.

Furthermore, special construction techniques provide a mechanical stability due to KSW´s patented working technology for both the chip and the antenna. The Thinlam® prelaminates maintain the highest durability thanks to the patented chip connection technology, which achieves tighter resonance frequency tolerances. KSW Thinlams® are manufactured without chip modules, ensuring an exceptionally plane card surface without sink marks. The technology is successfully proven and the Thinlam® guarantees durability and reliability.

In addition, as both sides of the card are fully opaque executable, both the chip and the antenna are visually screened. Therefore any potential deformation areas on the card are avoided when using KSW´s Thinlam®. Other common restrictions regarding visual card personalization are eliminated, allowing for new features to be applied above the chip area of the card, if required.

Thinlam® is available in polycarbonate, PVC, PET or Teslin® and can also be used for transparent RFID cards due to the excellent optical appearance.

KSW´s new Thinlam® generation of thinnest RFID prelaminates are commonly used manufacturing government ID documents including passports, driver´s licenses and identity cards and are also widely used in the ePayment sector.

About KSW KSW Microtec AG, with its headquarters in Germany, is the world´s leading supplier of RFID (Radio Frequency Identification) components for applications such as eTicketing, ePayment, Asset Management, Access Control and High Security. KSW combines successful high-end wafer processing, extremely efficient assembly technology and far-reaching expertise in design. KSW has earned itself a leading position on the market as one of the most efficient, and simultaneously most flexible, producers of RFID components. The globally active company was founded in 1994 and has clean room production facilities in Germany. KSW is an investment holding of the listed venture capital company Deutsche Effecten- und Wechsel-Beteiligungsgesellschaft AG headquartered in Jena. For more information see:

For further information, please contact:

Sandra Jaunich KSW Microtec AG Manfred-von-Ardenne-Ring 12 01099 Dresden - Germany Tel: +49 351 889 60 28 Fax: +49 351 889 60 11

Media contact: Tim Cockerell Wise Media S.p.A. Via Lepetit 4 20124 Milano - Italy Tel: +39 02 8903 4126 Fax: +39 02 67388322

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ots Originaltext: Deutsche Effecten- und Wechsel-Beteiligungsges. AG
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Further inquiry note:
Marco Scheidler
Tel.: +49 (0) 3641 573-3600

Branche: Financial & Business Services
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