Fujitsu Limited

euro adhoc: Fujitsu Limited
Fujitsu to Construct New Facility for Mass Production of Logic Chips Using 90nm and 65nm Process Technology (E)

---------------------------------------------------------------------   Disclosure announcement transmitted by euro adhoc.   The issuer is responsible for the content of this announcement. ---------------------------------------------------------------------

                                                                            Fujitsu Limited

Press Contact: Yuri Momomoto Fujitsu Limited, Public & Investor Relations Tel: 03-6252-2175

                  Fujitsu to Construct New Facility for Mass Production of
                        Logic Chips Using 90nm and 65nm Process Technology

New fab will use 300mm wafers

Tokyo, March 19, 2004 - Fujitsu Limited today announced that it has decided to construct a new facility at its Mie semiconductor plant in central Japan to mass-produce logic chips utilizing state-of-the-art 90-nanometer (nm) volume process technology as well as next-generation 65nm technology, and employing large-diameter 300mm wafers.

The new facility is scheduled to become operational from April 2005, with volume shipments to commence from September 2005, when demand for 90nm product is expected to intensify.  Fujitsu will initially invest about 75 billion yen for the first phase of construction through fiscal 2005, with phase two and subsequent investment to be made in stages and in careful consideration of market demand.  Total investment in the facility is expected to reach about 160 billion yen.  When fully equipped, the new facility will have a maximum production capacity of 13,000 wafers per month.

Fujitsu's Akiruno Technology Center on the outskirts of Tokyo has focused on leading-edge prototype chip development and volume production using 90nm technology, and since January 2003 it has been shipping 90nm product both internally and to outside customers.  The 90nm technology developed at Akiruno incorporates advanced transistor, copper wiring and Low-k* technologies that not only provide superior levels of performance, but which Fujitsu has successfully introduced in reference design flow applied in the development of large-scale system-on-chip devices.  In addition to use in its own products, Fujitsu's 90nm technology has attracted considerable interest from cutting-edge technology partners in Japan and overseas.

Toshihiko Ono, corporate senior vice president and group president of Fujitsu Limited's Electronic Devices Business Group commented: "The entire semiconductor industry has taken notice of the 90nm technology that we've developed at Akiruno, and we are determined to further extend our leadership as we move to 65nm and beyond. Investing in this new facility at Mie now will enable us to leverage this strength and fully meet our customers' requirements for quality products, competitive cost and stable volume supply."

Along with high-volume fabrication capability, Fujitsu's new facility at Mie will also be equipped to handle small-volume multi-product batch production.  In addition, in line with its "Green Factories" policies, Fujitsu will from the early planning stages incorporate measures to greatly reduce emissions and otherwise minimize the new facility's environmental burden.  Moreover, to avoid risk from potential earthquake damage and ensure operational stability for its customers, Fujitsu will be the first in the industry to equip its new fab building with a micro vibration control and seismically isolated structure.

Outline of New Facility

Process technology: 90nm/65nm CMOS logic

Wafer diameter: 300mm

Clean room area: 12,000m2

Production capacity: 13,000 wafers per month (maximum capacity)

Production system: Small-batch control as low as single wafer, multi-part processing

Planned operational startup: April 2005

Outline of Current Mie Plant

Location: 1500 Mizono, Tado-cho, Kuwana-gun, Mie Prefecture

Employees: 1,020

Main products: 0.18-micrometer / 0.13-micrometer ASICs, ASSPs, MCUs

Production capacity: 11,000 wafers per month

* Low-k refers to a layered insulating material having a low specific dielectric constant.  Effective for reducing capacitance within interconnect layers, the cutting-edge technology is used to realize ultra high-speed operation and low power consumption.

Related materials:

About Fujitsu Fujitsu is a leading provider of customer-focused IT and communications solutions for the global marketplace. Pace-setting technologies, highly reliable computing and telecommunications platforms, and a worldwide corps of systems and services experts uniquely position Fujitsu to deliver comprehensive solutions that open up infinite possibilities for its customers' success. Headquartered in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated revenues of 4.6 trillion yen (US$38 billion) for the fiscal year ended March 31, 2003. For more information, please see:

All company and product names mentioned herein are the trademarks or registered trademarks of their respective firms.

                                  This information is provided by RNS
                  The company news service from the London Stock Exchange

end of announcement            euro adhoc 19.03.2004

Further inquiry note: TEL:+81 (0) 3-6252-2176 FAX:+81 (0) 3-6252-2783 URL:

Branche: Hardware
ISIN:      JP3818000006
WKN:        0354912
Börsen:  Frankfurter Wertpapierbörse / official dealing
              SWX Swiss Exchange / official dealing
              London Stock Exchange / official dealing

Weitere Meldungen: Fujitsu Limited

Das könnte Sie auch interessieren: