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Atmel Announces 0.18um RF CMOS Foundry Process for Low Volume Applications

San Jose, California, November 9 (ots/PRNewswire)

- With Optional EEPROM, On-Chip Aluminum Inductors, 5 or 6 Metal
Layers
Atmel(R) Corporation (Nasdaq: ATML), announced today its 0.18
micron  AT58900 RF CMOS process technology for ASIC foundry customers
whose products  require high speed, low power RF devices, such as
those used in WLAN, WiMAX  and ZigBee applications. This new process
is manufactured on 200mm wafers  and features 1.8V CMOS transistors
and a vast array of passive components  that include low tolerance
analog poly resistors, N+ and P+ S/D resistors,  and up to four metal
layers. RF pads are included to help minimize interface  impedance.
Optional features include single poly EEPROM for on-chip analog
trimming or low density data storage. Minimization of circuit noise
can be achieved using optional triple well isolation transistors, low
channel-leakage MOS transistors, and isolated NMOS transistors. Other
optional features include high Q, low noise metal-insulator-metal
capacitors, and P+/N- varactors for optimum linearity. On-chip thick
aluminum inductors are available for impedance matching, which
reduces off-chip component requirements. Designers have access to
fifth and sixth metal layers to help simplify signal routing. A 3.3
volt input/output interface can be incorporated eliminating the need
for off-chip voltage doublers.
- Atmel offers frequent multi-project
wafer (MPW) runs that provide an economical means for customers to
debug prototype RF devices without purchasing an entire mask set.
Multiple customers share the same reticle and wafer-run, thereby
reducing the cost of entry. Prices for MPW runs are dependent on the
die size.
Production -- Atmel accepts minimum order quantities (MOQ) as low
as US$250K per year for production foundry products. All backend
services including test, characterization, qualification, design
verification, and supply chain management are available if required.
Design Kits -- Atmel offers a wide range of mature design
libraries and a Cadence design kit for the AT58900 that supports
accurate mixed signal simulation between digital, analog and RF
circuits. The digital standard cell libraries are supported in OPUS.
Atmel's 58900 0.18 micron RF CMOS process is available now.
About Atmel
Atmel is a worldwide leader in the design and manufacture of
microcontrollers, advanced logic, mixed-signal, nonvolatile memory
and radio frequency (RF) components. Leveraging one of the industry's
broadest intellectual property (IP) technology portfolios, Atmel is
able to provide the electronics industry with complete system
solutions. Focused on consumer, industrial, security, communications,
computing and automotive markets, Atmel ICs can be found Everywhere
You Are(R).
NOTE: Atmel(R), logo and combinations thereof, Everywhere You
Are(R) and others, are the registered trademarks or trademarks of
Atmel Corporation or its subsidiaries. Other terms and product names
may be trademarks of others.
Information:
Information on Atmel's 58900 RF CMOS process is available at
www.atmel.com/products/rfcmos/ or contact  rfcmos@atmel.com.
    Press Contacts
    Barbara Bailey, Marketing Communications Manager -- SiGe BiCMOS and RF
    CMOS Foundry
    Phone: +1-719-540-1895, Email:  bbailey@cso.atmel.com
    Veronique Sablereau, Corporate Communications Manager -- Europe
    Phone: +33-1-30-60-70-68, Fax: +49-71-31-67-24-23,
    Email:  veronique.sablereau@atmel.com
    Clive Over, Director of Press Relations -- USA and Asia
    Phone: +1-408-451-2855, Email:  cliveover@atmel.com
Web site: http://www.atmel.com

Contact:

Barbara Bailey, Marketing Communications Manager -- SiGe BiCMOS and
RF CMOS Foundry, +1-719-540-1895, or bbailey@cso.atmel.com, or
Veronique Sablereau, Corporate Communications Manager -- Europe,
+33-1-30-60-70-68, or fax, +49-71-31-67-24-23, or
veronique.sablereau@atmel.com, or Clive Over, Director of Press
Relations -- USA and Asia, +1-408-451-2855, or cliveover@atmel.com,
all of Atmel

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