PVA TePla AG

EANS-News: 80 Plus GIGA HS: Semiconductor Innovation by PVA TePla for Microchip Packaging

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New Products


Wettenberg (euro adhoc) - -       New industry standards for throughput

-       Higher yield  
-       100x300mm leadframe ready
-       Presented at SEMICON Taiwan 2012


(Kirchheim/Munich, October 19, 2012) - The business unit Plasma Systems of PVA
TePla in Kirchheim/Munich unveiled the next generation strip processing plasma
system (100x300mm leadframe ready - High Speed Plasma), setting new industry
standards in throughput at SEMICON Taiwan 2012. 

The 80 Plus High Speed (HS) is the only single chamber system in the world
featuring patent pending innovations in strip size conversion, handling and
process, allowing up to three times higher units per hour (UPH) compared to
other leadframe and substrate strip processing plasma systems to date. The
system is targeted at high volume chip manufacturers improving yield and
reliability for applications prior wire bonding, mold and flip chip underfill.

The 80 Plus High Speed is available in radio frequency (RF) and microwave (MW)
technology to provide the best process solution to meet customer demands. In
semiconductor microchip packaging plasma -prior wirebonding- is essential for
improving the cleanliness of the bond pads. Ball shear and stitch pull strengths
are dramatically enhanced by plasma cleaning. Plasma cleaning and activation is
used in applications of adhesion promotion of mold compounds, eliminating yield
loss due to delamination. In Flip Chip packaging technology MW plasma prior
underfill has become a must for yield improvement. Advanced Flip Chip devices
are gaining in market prominence, and microwave plasma processes are unrivalled
at penetrating the minute gaps beneath the dies.


Further inquiry note:
Helge Lüsebrink
PVA TePla AG 
Ammerthalstrasse 34 
85551 Kirchheim/Munich
Germany
Phone  +49(0)89 905 03 - 126
Fax     +49(0)89 905 03 - 147
helge.luesebrink@pvatepla.com 

www.pvatepla.com
www.pvateplaamerica.com

Product information is available:
http://www.tepla.com/semi.php

end of announcement                               euro adhoc 
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company:     PVA TePla AG
             Im Westpark 10-12
             D-35435 Wettenberg
phone:       +49(0)641 68690-0
FAX:         +49(0)641 68690-800
mail:     ir@pvatepla.com
WWW:      http://www.pvatepla.com
sector:      Misc. Industrials
ISIN:        DE0007461006
indexes:     CDAX
stockmarkets: free trade: Hannover, Berlin, München, Hamburg, Düsseldorf,
             Stuttgart, regulated dealing/prime standard: Frankfurt 
language:   English
 



Weitere Meldungen: PVA TePla AG

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