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Deutsche Effecten- und Wechsel-Beteiligungsges. AG

Thin - Thinner - Thinlam®

Dresden (euro adhoc) -

The revolutionary Thinlam®, a contactless prelaminate for RFID 
applications, joins the broad portfolio of innovative products 
launched this year by the global leader in RFID tag components
  ots.CorporateNews übermittelt durch euro adhoc mit dem Ziel einer
  europaweiten Verbreitung. Für den Inhalt der Mitteilung ist das Unternehmen
  verantwortlich.
Beteiligungen/KSW Microtec AG
November 28, 2008 - KSW Microtec AG
successfully launched Thinlam®, the contactless prelaminate for RFID 
card and government applications. Thinlam® is the latest in a series 
of new products launched from KSW Microtec this year, confirming the 
company´s position as dynamic innovator and setter of standards in 
the RFID industry.
The new KSW Thinlam®, with a thickness down to 280µm, sets new 
standards for card manufacturing. It enables manufacturers to produce
HF and UHF RFID cards with more layers, broadening the possibilities 
to integrate more security and other high value features into cards. 
The exceptional thinness is achieved by manufacturing the Thinlam® 
without chip modules - which also results in smoother card surfaces 
and better printing outcome. Thinlam® maintains the highest 
durability thanks to its unique patented chip connection technology. 
In addition, due to the consistently reproducible antenna geometries,
KSW Thinlam® achieves tighter resonance frequency tolerances. 
Thinlam® can be manufactured on PVC, Polycarbonate, PET or Teslin® 
and can also be used for transparent RFID cards thanks to its 
excellent optical characteristics.
Thinlam® is the ideal solution for any contactless personal 
identification application, where security, performance and design 
are important. Presented at Cartes & Identification and at ID WORLD, 
it received great feedback from partners, customers and visitors at 
both shows and is now available in volume quantities.
Other major product introductions from KSW this year include the new 
eGO dual frequency (HF/UHF) contactless transponder, the improved 
RFID-based VarioSens® Label with integrated temperature sensor and 
the contactless payment RFID sticker for mobile phones.
KSW combines in-depth technological expertise with the latest 
production techniques and has established itself as one of the most 
efficient - and at the same time most flexible - manufacturers of 
RFID components on the market. The company maintains close 
relationships with its customers in order to provide the highest 
quality RFID products that best suit the specific environments in 
which they are used.
About KSW KSW Microtec AG, with its headquarters in Germany, is the 
world‚s leading supplier of RFID (Radio Frequency Identification) 
components for special and standard applications such as public 
transport, ePayment, asset management, access control and high 
security applications. KSW combines successful high-end wafer 
processing, extremely efficient assembly technology and far-reaching 
expertise in design. KSW has earned itself a leading position on the 
market as one of the most efficient, and simultaneously most 
flexible, producers of RFID components. The globally active company 
was founded in 1994 and has clean room production facilities in 
Germany. KSW is an investment holding of the listed venture capital 
company Deutsche Effecten- und Wechsel-Beteiligungsgesellschaft AG 
headquartered in Jena. For more information see: www.ksw-microtec.de

Rückfragehinweis:

Sandra Jaunich
KSW Microtec AG
Manfred-von-Ardenne-Ring 12
01099 Dresden - Germany
Tel: +49 351 889 60 28
Fax: +49 351 889 60 11
sandra.jaunich@ksw-microtec.de
www.ksw-microtec.de

Branche: Finanzdienstleistungen
ISIN: DE0008041005
WKN: 804100
Index: CDAX, Classic All Share, Prime All Share
Börsen: Börse Frankfurt / Regulierter Markt/Prime Standard
Börse Berlin / Freiverkehr
Börse Stuttgart / Freiverkehr
Börse München / Freiverkehr

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