Heilbronn, Germany (ots/PRNewswire)
Atmel(R) Corporation (Nasdaq: ATML) announced today the
availability of a new System-in-Package (SiP) solution for LIN
automotive networking applications. The ATA6617, featuring maximum
integration, is the first member of an upcoming LIN SiP family. It
combines Atmel's LIN System Basis Chip (SBC) ATA6624 - including LIN
transceiver, voltage regulator, watchdog - and a well-known AVR(R)
microcontroller (ATtiny167 with 16k flash memory) in a single
package. With this highly integrated solution, customers can create
complete LIN nodes using just one IC.
The new LIN SiP is based on Atmel's second-generation LIN IP with
excellent EMC and ESD performance. It is optimized for low-cost LIN
slave applications and enables system cost reductions of up to 25%.
A powerful LIN UART with integrated hardware routines simplifies
protocol stack handling and limits the interrupt generation, thus
reducing the microcontroller load and flash memory consumption.
Simple assignment of an individual physical LIN node address, which
is important in applications such as air-conditioning systems, can
be realized by using an integrated 100 microampere current source.
One important criteria for LIN applications is low current
consumption. To ensure that the LIN node's current consumption is
well below 100 microampere in applications that are continuously
connected to the battery, the ATA6617 provides several current
saving modes where different functionalities are individually
switched off or on, depending on the application requirements.
All pins of the LIN system basis chip and the microcontroller are
bonded out, thus providing customers the same flexibility and
performance for their applications as with discrete parts.
Thanks to the extremely small QFN38 package, measuring only 5 mm
x 7 mm, designers can save more than 50% of PCB size compared to
Availability and Pricing
Samples of the new LIN IC ATA6617 are now available in small
QFN38 packages. Pricing starts at US $1.89 for 10k-piece quantities.
Various cost-effective tools support designers with the development
of LIN networks. A development board is available that enables a
quick start with the IC and allows prototyping and testing of new
designs. Certified LIN 2.0 and 2.1 protocol stacks from leading
suppliers are also available. Further LIN SiP family members,
including an 8 kB flash memory version, will be announced in Q2 2009.
EMC = Electro-Magnetic-Compatibility
ESD = Electronic Static Discharge
IP = Intellectual Property
LIN = Local Interconnect Network
PCB = Printed Circuit Board
QFN = Quad Flat No leads
SBC = System Basis Chip
SiP = System-in-Package
Atmel is a worldwide leader in the design and manufacture of
microcontrollers, advanced logic, mixed-signal, nonvolatile memory
and radio frequency (RF) components. Leveraging one of the industry's
broadest intellectual property (IP) technology portfolios, Atmel is
able to provide the electronics industry with complete system
solutions focused on consumer, industrial, security, communications,
computing and automotive markets.
(c) 2009 Atmel Corporation. All Rights Reserved. Atmel(R), Atmel
logo and combinations thereof, AVR(R) and others are registered
trademarks or trademarks of Atmel Corporation or its subsidiaries.
Other terms and product names may be trademarks of others.
Product information on Atmel's LIN SiP IC ATA6617 may be
Dr. Susanne van Clewe, Marcom Director Automotive
Phone: +49-7131-67-2081, Email: firstname.lastname@example.org
Helen Perlegos, Public Relations
Phone: +1-408-487-2963, Email: Helen.email@example.com
ots Originaltext: Atmel Corporation
Im Internet recherchierbar: http://www.presseportal.ch
Dr. Susanne van Clewe, Marcom Director Automotive, +49-7131-67-2081,
, or Helen Perlegos, Public Relations,
, both of Atmel Corporation